A research team has published details of a brain-computer interface that abandons the conventional approach of ...

Amid rising geopolitical tensions linked to semiconductors, European countries and industries are increasingly anxious about ...

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...

The Chip-based Industrial Innovation Program (Taiwan CBI), a decade-long, NT$300 billion (US$9.4 billion) initiative launched ...

For decades, the design of leading-edge chips has been a high-wire act—balancing tight deadlines, sophisticated workflows, and the relentless need to consult scattered, often outdated, sources of ...

Engineers at UC San Diego have designed an integrated circuit that sharply reduces the energy wasted when data centers ...

Collectively, the startup’s founding team has 10 decades of experience in chip design, AI applications and product development at Texas Instruments, Qualcomm and other global companies, alongside 70 ...

Baidu and Alibaba represent full-stack AI ecosystems, generating value across models, cloud, and now semiconductors.

From smartphones to aircraft, the miniature, delicate, and tiny microchips drive nearly every possible aspect of today's life. In 2025, terms like chip wars and rare minerals dominated global ...

AI compute is scaling at ~1.35× per year, nearly twice the pace of transistor scaling. Thus, the semiconductor industry has reached a hard inflection point: if we can’t scale down, we must scale up.